Metal Bond - Low Concentration

Low Concentration for brittle materials such as ceramics, glass, carbides and other heat-resistant materials

LOW CONCENTRATION Blade Type Diamond Concentration Speed (RPM's) Load (grams) Estimated Cutting Time
for use with hard/brittle materials such as Glass, Al203, Zr203, Concrete, hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides Hot Pressed Silicon Nitride Si3N4 Low 4,000 800 0:30
Boron Carbide B4C Low 3,500 700 0:15
Sapphire Al203 Low 1,500 300 0:40
Chromium Doped Sapphire Al203 Low 500 500 0:20
Partially stabilized Zirconia ZrO2 Low 2,500 500 0:38
Silicon Carbide, SiC Low 2,500 500 0:16
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3-inch (76.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$136.50

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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4-inch (102.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$147.00

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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5-inch (127.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$152.25

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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6-inch(152.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$168.00

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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7-inch (178.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$189.00

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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8-inch (203.0 mm) Diamond Wafering Blade Low Concentration (EACH)

$210.00

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be fou..

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