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15 µm - CARAT Diamond Grinding Disc - (MP), 200 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

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15 µm - CARAT Diamond Grinding Disc - (MP), 250 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

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15 µm - CARAT Diamond Grinding Disc - (MP), 300 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

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15 µm - CARAT Diamond Grinding Disc - (PSA), 200 mm

CARAT with self-adhesive backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces and superior..

Quickview

15 µm - CARAT Diamond Grinding Disc - (PSA), 250 mm

CARAT with self-adhesive backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces and superior..

Quickview

15 µm - CARAT Diamond Grinding Disc - (PSA), 300 mm

CARAT with self-adhesive backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces and superior..

Quickview

3 µm - CARAT Diamond Grinding Disc - (MP), 200 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

3 µm - CARAT Diamond Grinding Disc - (MP), 250 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

3 µm - CARAT Diamond Grinding Disc - (MP), 300 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

3 µm - CARAT Diamond Grinding Disc - (PSA), 200 mm

CARAT with self-adhesive backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces and superior..

Quickview

3 µm - CARAT Diamond Grinding Disc - (PSA), 250 mm

CARAT with self-adhesive backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces and superior..

Quickview

3 µm - CARAT Diamond Grinding Disc - (PSA), 300 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

6 µm - CARAT Diamond Grinding Disc - (MP), 200 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

6 µm - CARAT Diamond Grinding Disc - (MP), 250 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

Quickview

6 µm - CARAT Diamond Grinding Disc - (MP), 300 mm

CARAT with metal carrier plate for backing is a self-sharpening diamond disc for fine-grinding applications, replacing traditional SiC paper. Brittle materials such as nitride and oxide layers on steel can be ground without chipping, materials with low dimensional stability can be processed without deformation. Short process times, flat surfaces an..

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