5" Diamond Metal Bond Wafering Blades, High Concentration, ( 12.7mm Arbor ), Each

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Description

Diamond Metal Bond Blades High Concentration are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability. Diamond Blades High Concentration is Recommended for metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones. Also Recommended for general laboratory sectioning, either low (1000 RPM) speeds.

For cutting of ceramics and minerals (> HV 800). 
For cutting of ceramics and minerals (> HV 800).  

For manual cutting of minerals and composites with hard phases. 
For manual cutting of minerals and composites with hard phases. 
For cutting of ceramics and minerals (> HV 800). Can be used with manual cutting table.  
For cutting of ceramics (> HV 800) and minerals.

Materials recommended for cutting with Diamond Metal Bond Blades High Concentration:

Metal matrix composites, Titanium, Thermal spray coatings, Printed circuit boards, Bones.

Excellent for cutting rock, re-factory, mineral, ceramic, glass, cement, concrete, and other non-metallic materials.

For general use with ferrous and non-ferrous alloys; copper, aluminum, metal matrix composites, PCB boards, bones, thermal spray coatings and titanium alloy.

Features
Brand
Metallography World Corporation
Diamond Wafering Blades Specs
Arbor Hole
0.500"
Diameter
5"
Material Type
Metal Bond, High
Per Package
1/Box
Product Type
Diamond Wafering Blades
Recommended For
For cutting of ceramics and minerals (> HV 800)
Thickness
0.015"
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